Improving the sidewall quality of nanosecond laser-drilled deep through-silicon vias by incorporating a wet chemical etching process

Tang, C.-W.C.-W.TangLi, K.-M.K.-M.LiYoung, H.-T.H.-T.YoungHONG-TSU YOUNGKUAN-MING LI2018-09-102018-09-102012http://www.scopus.com/inward/record.url?eid=2-s2.0-84879851168&partnerID=MN8TOARShttp://scholars.lib.ntu.edu.tw/handle/123456789/370895Improving the sidewall quality of nanosecond laser-drilled deep through-silicon vias by incorporating a wet chemical etching processjournal article10.1049/mnl.2012.0303