Infrared Joining of TiAl Intermetallics Using Ti-15Cu-15Ni Foil, Part II: The Microstructure Evolution at High Temperature

Lee, S.J.S.J.LeeWu, S.K.S.K.WuLin, R.Y.R.Y.Lin2008-11-192018-06-282008-11-192018-06-281998http://ntur.lib.ntu.edu.tw//handle/246246/86858application/pdf1110064 bytesapplication/pdfen-USInfrared Joining of TiAl Intermetallics Using Ti-15Cu-15Ni Foil, Part II: The Microstructure Evolution at High Temperaturejournal articlehttp://ntur.lib.ntu.edu.tw/bitstream/246246/86858/1/60.pdf