Lee, Shao-KuanShao-KuanLeeTuan, Wei-HsingWei-HsingTuanWEI-HSING TUAN2020-05-122020-05-1220151546542Xhttps://scholars.lib.ntu.edu.tw/handle/123456789/492258[SDGs]SDG14Eliminating Voids at Al <sub>2</sub> O <sub>3</sub> -Cu Interface During Direct Bondingjournal article10.1111/ijac.12314http://doi.wiley.com/10.1111/ijac.12314