國立臺灣大學電子工程學研究所陳中平2006-07-262018-07-102006-07-262018-07-102004-07-31http://ntur.lib.ntu.edu.tw//handle/246246/20016Recent studies show that the nonuniform thermal distribu- tion on the substrate and interconnects has impact on the circuit reliability and performance. Hence three-dimensional (3-D) thermal analysis is crucial to analyze these e®ects. In this year, we develop an e±cient 3-D transient thermal simulator based on the alternating direction implicit (ADI) method for large scale temperature estimation problems. Our simulator, 3D Thermal-ADI, not only has a linear run- time and memory requirement, but also is unconditionally stable. Detailed analysis of the 3-D nonhomogeneous cases and boundary conditions for on-chip VLSI applications are introduced and presented. Extensive experimental results show that our algorithm is not only orders of magnitude faster than the traditional thermal simulation algorithms, but is also highly accurate and memory e±cient. The tem- perature pro¯le of steady state can be reached in few itera- tions. The software is avaiable on the web [1].application/pdf389721 bytesapplication/pdfzh-TW國立臺灣大學電子工程學研究所reporthttp://ntur.lib.ntu.edu.tw/bitstream/246246/20016/1/922218E002030.pdf