Intermetallic Compounds formed during the Soldering Reactions of Eutectic Sn-9Zn with Cu and Ni Substrates

Chan, Y. C.Y. C.ChanChiu, M. Y.M. Y.ChiuChuang, T. H.T. H.Chuang2009-01-062018-06-282009-01-062018-06-282002http://ntur.lib.ntu.edu.tw//handle/246246/95925en-USIntermetallic Compounds formed during the Soldering Reactions of Eutectic Sn-9Zn with Cu and Ni Substratesjournal article