Chuang, Tung-HanTung-HanChuang2009-01-062018-06-282009-01-062018-06-28200710735623http://ntur.lib.ntu.edu.tw//handle/246246/95962https://www.scopus.com/inward/record.uri?eid=2-s2.0-34347235530&doi=10.1007%2fs11661-007-9126-5&partnerID=40&md5=749de7f946e5375f60f9b36493e6b532The whisker growth in Sn-3Ag-0.5Cu-0.5Ce solder joints after storage at various temperatures is investigated. After reflow, cluster-shaped CeSn3 precipitates form in the solder matrix. It is much easier for the surface of the CeSn3 phases to oxidize than for the solder matrix. The oxidation of the outer surface of these CeSn3 precipitates is accompanied by rapid growth of tin whiskers. Storage temperature affects the morphology and growth kinetics of the whiskers, which are also correlated with the oxidation rates of the CeSn3 surface at various temperatures. The results showed that the driving force for the growth of tin whiskers in this Sn-3Ag-0.5Cu-0.5Ce solder is the compressive stress induced by the diffusion of oxygen into the CeSn3 precipitate clusters, which results in the lattice expansion in the oxidized CeSn3 phase. © The Minerals, Metals & Materials Society and ASM International 2007.application/pdf574375 bytesapplication/pdfen-USCompressive stress; Crystal whiskers; Diffusion; Doping (additives); Morphology; Oxidation; Precipitates; Rare earth elements; Thermal effects; Tin alloys; Oxidation rates; Whisker growth; Soldered jointsjournal article2-s2.0-34347235530http://ntur.lib.ntu.edu.tw/bitstream/246246/95962/1/104.pdf