Hung L.Y.Chang P.H.Chang C.C.Wang Y.P.Hsiao C.S.C. ROBERT KAO2019-11-272019-11-2720089781424436248https://www.scopus.com/inward/record.uri?eid=2-s2.0-64049107879&doi=10.1109%2fIMPACT.2008.4783859&partnerID=40&md5=f30e464f692e419a1301ea9771ef0454https://scholars.lib.ntu.edu.tw/handle/123456789/432684Microstructure study of high lead bump FCBGA bending testconference paper10.1109/IMPACT.2008.47838592-s2.0-64049107879