臺灣大學: 電子工程學研究所吳安宇銀子駒Yin, Tz-ChuTz-ChuYin2013-04-102018-07-102013-04-102018-07-102011http://ntur.lib.ntu.edu.tw//handle/246246/257064本文針對熱感知三維晶片內網路設計的效能降低問題做出演算法和架構設計。傳統上為了確保溫度上安全以及避免效能被溫度限制大幅縮減，我們需要及時溫度控制機制。若我們因為及時溫度控制機制，而針對快超過臨界溫度的路由器來啟動壓制以便降溫，卻會造成系統拓撲變成非穩態不規則狀網狀拓撲。為了在非穩態不規則狀網狀拓撲下讓封包能成功地傳送，我們為熱感知三維晶片網路下，提出一個傳輸層協助路由演算法。根據實驗結果，我們提出的演算法能有效地增加效能，以及使交通負擔量更加平衡。我們基於低成本實現技術，提出記憶體降低技術，只需多11.1%得實現成本，可獲得 1.7x 的吞吐量提升。In this thesis, we proposed algorithm and architecture design for performance reduction in thermal-aware 3D network-on-chip (NoC). To ensure thermal safety and avoid huge performance back-off from the temperature constraint, run time thermal management is required. However the regulation of temperature requires throttling of the near-overheated router, which makes the topology become Non-Stationary Irregular Mesh (NSI-mesh). To successfully deliver packet in NSI-mesh, we propose a Transport Layer Assisted Routing (TLAR) secheme for thermal-aware 3D NoC. Based on the experimental results, the proposed routing scheme can significantly improve the performance and balance traffic load. For low cost implementation, we also propose memory reduction techniques, and we gain 1.7x throughput improvement for only 11.1% area overhead.1846764 bytesapplication/pdfen-US三維晶片晶片內網路溫度相關傳輸層3 DNetwork-on-Chipthermal-awaretransport-layerthesishttp://ntur.lib.ntu.edu.tw/bitstream/246246/257064/1/ntu-100-R98943140-1.pdf