Effect of decomposition and organic residues on resistivity of copper films fabricated via low-temperature sintering of complex particle mixed dispersions

Yong, Y.Y.YongNguyen, M.T.M.T.NguyenTsukamoto, H.H.TsukamotoMatsubara, M.M.MatsubaraLiao, Y.-C.Y.-C.LiaoYonezawa, T.T.YonezawaYING-CHIH LIAO2020-01-062020-01-062017https://scholars.lib.ntu.edu.tw/handle/123456789/445956Effect of decomposition and organic residues on resistivity of copper films fabricated via low-temperature sintering of complex particle mixed dispersionsjournal article10.1038/srep451502-s2.0-85016137248https://www.scopus.com/inward/record.uri?eid=2-s2.0-85016137248&doi=10.1038%2fsrep45150&partnerID=40&md5=e74428e91e3a9ea7f6845d3f1aac2e82