An innovative annealing-twinned Ag-Au-Pd bonding wire for IC and LED packaging

Tsai, H.-H.H.-H.TsaiLee, J.-D.J.-D.LeeTsai, C.-H.C.-H.TsaiWang, H.-C.H.-C.WangChang, C.-C.C.-C.ChangChuang, T.-H.T.-H.ChuangTUNG-HAN CHUANG2020-05-122020-05-122012https://scholars.lib.ntu.edu.tw/handle/123456789/491984An innovative annealing-twinned Ag-Au-Pd bonding wire for IC and LED packagingconference paper10.1109/IMPACT.2012.64202412-s2.0-84874227019https://www.scopus.com/inward/record.uri?eid=2-s2.0-84874227019&doi=10.1109%2fIMPACT.2012.6420241&partnerID=40&md5=b1f0853d0bf9325b96824941c0efb41b