Y. C. ChenF. L. ChangM. C. ChuangY. C. SuC. ROBERT KAO2024-07-152024-07-152024-04-179784991191176https://www.scopus.com/record/display.uri?eid=2-s2.0-85195511637&origin=resultslisthttps://scholars.lib.ntu.edu.tw/handle/123456789/719785In recent years, the electronic packaging industry emphasized on low-temperature solder as a strategic focus to mitigate warpage issues during the reflow process. Sn-Bi solder alloys has emerged as potential candidates due to their low melting points and lower costs; however, the presence of large Bi phase fractions in the eutectic Sn-Bi solder introduces reliability issues due to the inherent brittleness of Bi. In this study, a low-temperature Sn47Bi1In2Zn solder alloy with a solidus of 120°C measured by DSC was developed through thermodynamic calculations based on the CALPHAD (CALculation of PHAse Diagram) method using the PANDAT software. The goal of this study is to find a low-temperature solder alloy with the CALPHAD-type thermodynamic calculation methods. Furthermore, we found out that the double addition of In and Zn both decreases the melting point of Sn-Bi alloy, which could be first predicted and illustrated in the vertical section calculation in the PANDAT software. Finally, a low-temperature Sn-Bi-In-Zn quaternary solder alloy was developed.falseCALPADLow-temperature solderSn-Bi-In-Zn quaternary solder alloyThermodynamic calculationconference paper10.23919/ICEP61562.2024.105355712-s2.0-85195511637