Novel Method for In-Situ Monitoring of Thickness of Silicon Wafer during Wet Etching

Lee, Chi-YuanChi-YuanLeeChang, Pei-ZenPei-ZenChangChen, Yung-YuYung-YuChenDai, Ching-LiangChing-LiangDaiWang, Xuan-YuXuan-YuWangChen, Ping-HeiPing-HeiChenLee, Shuo-JenShuo-JenLee2009-01-212018-06-292009-01-212018-06-292006-05http://ntur.lib.ntu.edu.tw//handle/246246/106996en-USNovel Method for In-Situ Monitoring of Thickness of Silicon Wafer during Wet Etching2-s2.0-33745785227WOS:000238800300002