莊東漢2006-07-252018-06-282006-07-252018-06-282003http://ntur.lib.ntu.edu.tw//handle/246246/12445本子計劃第三年的主要目的係延伸第一年的無鉛焊錫球格陣列構裝製程研究與第二年計劃的冷熱循環疲勞破壞分析等重要實驗結果,進一步對BGA構裝無鉛焊錫接點,建立一套完整的可靠度試驗方法模擬冷熱循環下的疲勞現象,以迅速評估電子產品銲錫接點的可靠度品質。本年度另一研究重點為構裝模組的電性分析,提供更直接的應用參考數據,探討疲勞裂紋的萌生與成長。此外,本年度亦利用有限元素法模擬計算三點彎曲試驗的撓度與最大等效塑性應變量的對應關係, 代入Coffin-Manson方程式求出疲勞壽命,並與實驗值進行相互比較及驗證。The purpose of this study is to build up a complete reliability testing method for the simulation of fatigue phenomenon during the thermal cycling test in order to rapidly evaluate the reliability of Pb-free solder joints of BGA packages. Another effort of this project is the electrical analysis of packages to provide a direct information of crack nucleation and propagation during fatigue failure. In addition, the third year program also involves the finite element method to calculate the relation between the deflection and maximal equivalent plastic deformation. The fatigue life is obtained using Coffin-Manson equation, which is compared with the experimental results.application/pdf293206 bytesapplication/pdfzh-TW國立臺灣大學材料科學與工程學研究所無鉛銲錫球格陣列構裝冷熱循環試驗動態疲勞試驗電性分析reliabilityfatiguethermal cyclingCoffin-Manson.無鉛銲錫球格陣列構裝製程與可靠度分析─子計畫一:無鉛銲錫球格陣列構裝接點之冷熱循環與動態疲勞分析(III)reporthttp://ntur.lib.ntu.edu.tw/bitstream/246246/12445/1/912216E002037.pdf