Active soldering of ZnS–SiO2 sputtering targets to copper backing plates using an Sn3.5Ag4Ti(Ce, Ga) filler metal

Chang, S.Y.S.Y.ChangChuang, T.H.T.H.ChuangTsao, L.C.L.C.TsaoYang, C.L.C.L.YangYang, Z.S.Z.S.Yang2009-01-062018-06-282009-01-062018-06-282008http://ntur.lib.ntu.edu.tw//handle/246246/95966application/pdf1329250 bytesapplication/pdfen-USActive soldering of ZnS–SiO2 sputtering targets to copper backing plates using an Sn3.5Ag4Ti(Ce, Ga) filler metaljournal articlehttp://ntur.lib.ntu.edu.tw/bitstream/246246/95966/1/108.pdf