Evaluations of whisker growth and fatigue reliability of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.05Ce solder ball grid array packages

Chuang, T.-H.T.-H.ChuangCheng, C.-Y.C.-Y.ChengChang, T.-C.T.-C.ChangTUNG-HAN CHUANG2020-05-122020-05-122009https://scholars.lib.ntu.edu.tw/handle/123456789/491991Evaluations of whisker growth and fatigue reliability of Sn-3Ag-0.5Cu and Sn-3Ag-0.5Cu-0.05Ce solder ball grid array packagesjournal article10.1007/s11664-009-0912-22-s2.0-72549107357https://www.scopus.com/inward/record.uri?eid=2-s2.0-72549107357&doi=10.1007%2fs11664-009-0912-2&partnerID=40&md5=29af2a2179d834864575b5fde8c93f09