2005-01-012024-05-17https://scholars.lib.ntu.edu.tw/handle/123456789/683205摘要：本計畫針對鋁/銅散熱器的製作,將研發鋁/銅複合板及銅/鋁蜂巢/銅三明治之界面異質接合技術,主要將採用三種方法:1.共晶接合 2.過渡液相接合 3.添加稀土活性填料接合. 接合後之工件將分析其接合強度及接合界面微結構. 最後利用實驗所得最佳接合條件製作系統元件冷卻用鋁/銅散熱器.<br> Abstract: The effort of this project will be concerned with the Al/Cu heat dissipators. For this purpose, the dissimilar materials bonding technology for the Al/Cu composit plate plate and Cu/Al honeycomb/Cu sandwich structure will be developed. Three methods are adapted in this research: 1.eutectic bonding, 2.transient liquid phase bonding, 3.active soldering by adding rare earth elements. After bonding, the strength and interfacial microstructure of the workpieces will be evaluated. Finally, the Al/Cu heat dissipators for the cooling of system components will be manufactured by using the optimized bonding conditions.散熱器共晶接合過渡液相接合活性填料接合Heat DissipatorsEutetic BondingTransient Liquid Phase BondingActive Soldering