An investigation of smooth nano-sized copper seed layers on TiN and TaSiN by new non-toxic electroless plating

RU-SHI LIUYou, C. C.C. C.YouTsai, M. S.M. S.TsaiHu, S. F.S. F.HuLi, Y. H.Y. H.LiLu, C. P.C. P.Lu2018-09-102018-09-102003http://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcAuth=ORCID&SrcApp=OrcidOrg&DestLinkType=FullRecord&DestApp=WOS_CPL&KeyUT=WOS:000181023700018&KeyUID=WOS:000181023700018http://scholars.lib.ntu.edu.tw/handle/123456789/301689An investigation of smooth nano-sized copper seed layers on TiN and TaSiN by new non-toxic electroless platingjournal article10.1016/s0038-1098(02)00821-92-s2.0-0037303599WOS:000181023700018