Tsai, H.-H.H.-H.TsaiTsai, C.-H.C.-H.TsaiLee, J.-D.J.-D.LeeChang, D.D.ChangShih, Y.-T.Y.-T.ShihChen, C.-H.C.-H.ChenChuang, T.-H.T.-H.ChuangTUNG-HAN CHUANG2020-05-122020-05-122015https://scholars.lib.ntu.edu.tw/handle/123456789/491969Applications of Ag-Alloy stud bump for IC and LED packagesconference paper10.1109/IMPACT.2014.70484352-s2.0-84925843778https://www.scopus.com/inward/record.uri?eid=2-s2.0-84925843778&doi=10.1109%2fIMPACT.2014.7048435&partnerID=40&md5=6dc70936e14e07b7743e666a98948a39