Yu, HaiyangHaiyangYuC. ROBERT KAO2023-06-162023-06-162022-01-019781665492690https://scholars.lib.ntu.edu.tw/handle/123456789/632806Due to its low cost, the Cu/Sn/Ni microbump is the most widely used structure in electronic packaging. Recent studies have characterized the evolution of the microstructure and phase formation in this system, and a unique (Cu,Ni)6Sn5 phase has been discovered with a high Ni content. However, there has been debate over the formation mechanism of this phase. This study builds a model of the formation mechanism of (Cu,Ni)6Sn5 and provides direct proof.(Cu,Ni) Sn 6 5 | formation mechanism | microbumpconference paper10.1109/ICTA56932.2022.99629772-s2.0-85143981983https://api.elsevier.com/content/abstract/scopus_id/85143981983