Chip-package-board co-design - A DDR3 system design example from circuit designers' perspective

Lin, Y.-H.Y.-H.LinChou, J.J.ChouLu, Y.-C.Y.-C.LuWu, T.-L.T.-L.WuYI-CHANG LUHSIN-SHU CHENTZONG-LIN WU2018-09-102018-09-102008http://www.scopus.com/inward/record.url?eid=2-s2.0-60649106966&partnerID=MN8TOARShttp://scholars.lib.ntu.edu.tw/handle/123456789/340735Chip-package-board co-design - A DDR3 system design example from circuit designers' perspectiveconference paper10.1109/EDAPS.2008.4735990