Real time monitoring of thickness of silicon membrane during wet etching using a novel surface acoustic wave sensor

Lee, C.-Y.C.-Y.LeeWu, T.-T.T.-T.WuChen, Y.-Y.Y.-Y.ChenCheng, Y.-C.Y.-C.ChengChen, W.-J.W.-J.ChenPao, S.-Y.S.-Y.PaoChang, P.-Z.P.-Z.ChangChen, P.-H.P.-H.ChenYen, K.-H.K.-H.YenPING-HEI CHENPEI-ZEN CHANGTSUNG-TSONG WU2020-04-282020-04-282004https://scholars.lib.ntu.edu.tw/handle/123456789/487075Real time monitoring of thickness of silicon membrane during wet etching using a novel surface acoustic wave sensorconference paper10.1117/12.5449592-s2.0-8844235075https://www.scopus.com/inward/record.uri?eid=2-s2.0-8844235075&doi=10.1117%2f12.544959&partnerID=40&md5=82a1edb028ea97944f5b76aeb3a83820