Intermetallic compounds formed during the reflow of In-49Sn solder ball-grid array packages

Chuang, T.H.T.H.ChuangChang, S.Y.S.Y.ChangTsao, L.C.L.C.TsaoWeng, W.P.W.P.WengWu, H.M.H.M.WuTUNG-HAN CHUANG2020-05-122020-05-122003https://scholars.lib.ntu.edu.tw/handle/123456789/492026Intermetallic compounds formed during the reflow of In-49Sn solder ball-grid array packagesjournal article10.1007/s11664-003-0193-02-s2.0-0037349029https://www.scopus.com/inward/record.uri?eid=2-s2.0-0037349029&doi=10.1007%2fs11664-003-0193-0&partnerID=40&md5=eff1479138b6cb446b06989ff31b4572