Active soldering of indium tin oxide (ITO) with Cu in air using an Sn3.5Ag4Ti(Ce, Ga) filler

Chang, S. Y.S. Y.ChangTsao, L. C.L. C.TsaoChiang, M. J.M. J.ChiangChuang, T. H.T. H.ChuangTung, C. N.C. N.TungPan, G. H.G. H.Pan2009-01-062018-06-282009-01-062018-06-282003http://ntur.lib.ntu.edu.tw//handle/246246/95941application/pdf702673 bytesapplication/pdfen-USActive soldering of indium tin oxide (ITO) with Cu in air using an Sn3.5Ag4Ti(Ce, Ga) fillerjournal articlehttp://ntur.lib.ntu.edu.tw/bitstream/246246/95941/1/83.pdf