Lin Y.H.Tsai C.M.Hu Y.C.Lin Y.L.Tsai J.Y.C. ROBERT KAO2019-11-272019-11-27200502555476https://www.scopus.com/inward/record.uri?eid=2-s2.0-17044413733&partnerID=40&md5=b0659801f3f122318f9736e6e6e10a7fhttps://scholars.lib.ntu.edu.tw/handle/123456789/432714Electromigration induced metal dissolution in flip-chip solder jointsconference paper2-s2.0-17044413733