2020-10-012024-05-15https://scholars.lib.ntu.edu.tw/handle/123456789/664051摘要：電子工業的快速發展增加了電子設備的功率密度，這也給電子設備的熱管理帶來了嚴峻的挑戰。最先進的電子設備的功率密度可能會高於1000 W/cm^2 ，而傳統的空氣冷卻方法不足以實現高功率密度電子設備的熱管理。沸騰熱傳具有大的潛熱是冷卻高功率密度電子設備的有希望的候選者。池沸騰的臨界熱通量(CHF)設置了沸騰傳熱中最大散熱量的上限，而臨界熱通量(HTC)決定了冷卻方法的有效性。我們已經證明了使用微/奈米結構來增強相變傳熱，如冷凝傳熱，蒸發傳熱和沸騰傳熱。我們在矽奈米線陣列和微柱陣列上獲得了增強的CHF和HTC。在我們以前的工作中，獲得的最高CHF和HTC分別約為200 W/cm^2和5 W/cm^2-K，這雖然是文獻中的領先值之一。但是，所獲得的CHF仍遠低於動力學理論所預測的極限值&#12316;10^4 W/cm^2，也低於最先進的電子設備的功率密度1000 W/cm^2，因此，需要進一步提高CHF和HTC。在這項工作中，我們建議使用三維(3D)親疏水混合微結構表面來促進CHF和HTC。在3D親疏水混合表面上，可以在疏水大柱陣列的頂部生成蒸氣氣泡，並且可以將液體吸入底部親水小柱陣列。因此，蒸氣逸出和液體吸入將不會彼此干擾，這可以潛在地消除引起CHF的流體動力不穩定性極限。在該計畫中，我們將研究3D混合表面上的沸騰傳熱。此外，亦將討論柱密度和疏水/親水比對沸騰傳熱的影響，並將建立理論模型來關聯實驗數據<br> Abstract: The rapid development of the electronic industry has increased the power density of the electronics, which also caused a severe challenge in their thermal management. The power density of the state-of-the-art electronics could be higher than 1000 W/cm^2 and the traditional air-cooling methods are not sufficient for the thermal management of the high-power-density electronics. Boiling heat transfer along with its isothermal liquid-vapor phase transition and a large latent heat is a promising candidate for cooling the high power density electronics. The critical heat flux (CHF) of pool boiling sets the upper limit of the maximum heat dissipation in boiling heat transfer, and the heat transfer coefficient (HTC) determines the efficacy of the cooling method. We have demonstrated using micro/nanostructures to enhance phase-change heat transfer, including condensation heat transfer, evaporative heat transfer, and boiling heat transfer. The enhanced CHF and HTC were obtained on the Si nanowire arrays and micropillar arrays. The obtained highest CHF and HTC in our previous works were approximately 200 W/cm^2 and 5 W/cm^2-K, respectively, which are among the highest reported values in the literature. However, the obtained CHF was still far below the limit predicted by the kinetic theory of ~10^4 W/cm^2 and was also below the power density of the state-of-the-art electronics of 1000 W/cm^2. Thus, a further enhancement of the CHF and HTC is required. In this work, we proposed using a three-dimensional (3D) hybrid microstructured surface to promote the CHF and HTC. On the 3D hybrid surface, vapor bubbles can be generated at the top of the hydrophobic big pillar array and liquid can be sucked into the bottom hydrophilic small pillar array. Thus, the vapor escape and liquid sucking will not interfere with each other, which can potentially eliminate the hydrodynamic instability limit causing the CHF. In this project, boiling heat transfer on the 3D hybrid surfaces will be investigated. Besides, the effects of pillar density and hydrophobic/hydrophilic ratio on boiling heat transfer will be discussed. Moreover, a theoretical model will be established to correlate the experimental data.沸騰熱傳臨界熱通量臨界熱通量三維親疏水混合微結構表面Boiling heat transferCritical heat fluxHeat transfer coefficientThree-dimensional hybrid microstructured surface