Effect of Surface Finish on the Failure Mechanisms of Flip-Chip Solder Joints Under Electromigration

Lin, Y.L.Y.L.LinLai, Y.S.Y.S.LaiTsai, C.M.C.M.TsaiKao, C.R.C.R.Kao2008-12-312018-06-282008-12-312018-06-282006http://ntur.lib.ntu.edu.tw//handle/246246/95481application/pdf379464 bytesapplication/pdfen-USEffect of Surface Finish on the Failure Mechanisms of Flip-Chip Solder Joints Under Electromigrationjournal articlehttp://ntur.lib.ntu.edu.tw/bitstream/246246/95481/1/04.pdf