Lin, W.H.W.H.LinWu, Albert T.Albert T.WuLin, S.Z.S.Z.LinChuang, T.H.T.H.ChuangTu, K.N.K.N.Tu2009-01-062018-06-282009-01-062018-06-282007http://ntur.lib.ntu.edu.tw//handle/246246/95965application/pdf412779 bytesapplication/pdfen-USElectromigration in the Flip Chip Solder Joint of Sn-8Zn-3Bi on Copper Padsjournal articlehttp://ntur.lib.ntu.edu.tw/bitstream/246246/95965/1/107.pdf