楊申語Yang, Sen-Yeu臺灣大學:機械工程學研究所陳建瑋Chen, Jian-WeiJian-WeiChen2010-06-302018-06-282010-06-302018-06-282009U0001-2907200901041800http://ntur.lib.ntu.edu.tw//handle/246246/187126本論文以開發氣體輔助軟模轉印技術為主軸，研究以快速簡單的製程技術製作微結構。此製程主要特色有：一.製程單純；二.所製作的微結構無殘留層，不須額外去除殘留層步驟，有效降低製程複雜性，並提高可應用材料之多樣性；三.可製作多層微結構；四.製程相容性高，只要是可溶液製程(solution-processable)之材料皆可進行轉印；五.無須額外化學方法即可進行轉印。論文主要研究內容包括黃光微影製程製作底部平整之微結構母模、PDMS鑄造技術製作彈性軟模具、利用有限元素法進行軟模變形模擬分析、單層與雙層微結構轉印製程之開發與微結構轉印製程之應用等部分。底部平整之微結構母模製作方面，本研究以電感耦合電漿蝕刻法、乾膜光阻定義圖案與SU-8厚膜光阻定義圖案製作微結構圖案母模，並探討三種方式之優缺點。在軟模變形模擬分析部分，利用光學顯微鏡觀察PDMS軟模實際受力變形的狀態，證明利用有限元素法分析軟模變形狀態之可行性。根據模擬結果，垂直方向壓力會致使PDMS模具微結構間間隙產生垂直方向的位移，可能導致轉印殘留層的產生。模擬結果更提出藉著改變PDMS模具厚度可以有效降低間隙垂直位移量，防止殘留層產生。單層與雙層微結構轉印製程之開發方面，提出表面能控制機制，以獲得成功之轉印結果。針對PDMS模具進行氧氣電漿表面處理，藉此提高PDMS模具表面能，使墨水能均勻塗佈於PDMS模具表面，再以加熱方式恢復PDMS模具原有之低表面能特性，同時藉著提高基材溫度增加基材表面能，搭配適當之製程參數，EPG 510光阻墨水可完整轉印至壓克力基材上，且無殘留層產生，並證實微結構轉印製程可將EPG 510光阻轉印於不同基材上(包括PMMA、鋁、不鏽鋼、PET、PC、矽晶片與ITO)。在轉印製程之應用方面，本研究驗證轉印導電高分子材料(PEDOT:PSS)於PMMA基材上，直接製作出有機薄膜電晶體之源極/汲極結構。另外本研究也驗證轉印製程可直接轉印光阻於ITO薄膜與鋁基材上，作為蝕刻擋罩與無電鍍鎳擋罩，而不需經過黃光微影製程。The thesis develops a micro transfer stamping technique to fabricate microstructures. There are five advantages of the micro transfer stamping technique: 1. This is a simple process; 2. There is no residual layer, therefore no additional process is needed to remove the residual layer; 3. The process can fabricate multi-layer structure; 4. The process is theoretically suitable for all solution-processable materials; 5. No additional chemical process is needed in the process.here are five research topics in this thesis, including fabrication of mold with flat bottom surface using lithography process, casting technique for fabricating PDMS mold, deformation simulation of PDMS mold in the transfer stamping process, development of single-/ multi- layer transfer stamping process, and application of the micro transfer stamping process.n the section of fabrication of mold with flat bottom surface using lithography process, for obtaining the mold with flat bottom surface, ICP, dry film resist and SU-8 were used to fabricate the master mold with microstructures, and compared advantages and disadvantages in this study. In the “deformation simulation of soft mold in the transfer stamping process” section, to verify the accuracy of Infinite Element simulation, we observed the real deformation of PDMS mold using optic microscopy. According to the simulation results, the “gap” between microstructures of PDMS mold sags as the applied pressure is high enough or the gap length is large. A large sagging distance would lead to residual layer appearance in the transfer stamping process. It was found that increasing PDMS mold thickness could prevent residual layer forming.n the section of development of single-/ multi-layer transfer stamping process, we proposed a method of controlling the surface energy to transfer stamping. PDMS mold was treated by oxygen plasma surface treatment to increase the surface energy for uniformly spin coating “ink” on PDMS mold. And then, with proper pressure, temperature, and heating the PDMS mold to restore surface energy for detaching, the ink (EPG510) could successfully be transferred on the PMMA substrate with no residual layer. The section also proves that the micro transfer stamping technique can transfer the ink (EPG510) on various substrate, such as PMMA, aluminum, PET, PC, silicon wafer and ITO. In the section of application of micro transfer stamping technique, we proved that the micro transfer stamping can successfully transfer PEDOT:PSS on PMMA. We also proved that the single-layer transferred PR patterns can replace lithography process, to be directly used as the etching mask or electroless nickel plating mask.誌謝 I文摘要 II文摘要 III錄 V目錄 X目錄 XVII一章 導論.1 各種精密複製成型技術 1.2 多層結構製作技術介紹 2.3 應用塑膠高分子材料轉印技術優勢 2.4 有機薄膜電晶體元件 3.5 具體研究方向與目標 4.6 論文內容與架構 5二章 文獻回顧.1 結構轉印技術 10.2 浮雕轉印技術 11.3 多層結構元件轉印技術 11.4 氣體輔助壓印文獻 13.5 有機薄膜電晶體 14.5.1 有機薄膜電晶體元件介紹 15.5.2 有機半導體材料 16.6 有機薄膜電晶體(OTFT)製程相關文獻 17.7 文獻總體回顧與研究創新 20三章 初步製程與實驗設備.1 微結構圖案母模製作 38.1.1 電感耦合電漿蝕刻法(ICP)製作微結構圖案母模 38.1.2 乾膜光阻定義圖案製作微結構母模 41.1.3 SU-8厚膜光阻定義圖案製作微結構母模 42.1.4 微結構圖案母模製作成果與比較 44.2 PDMS軟模製作 46.2.1 PDMS材料介紹 46.2.2 翻製PDMS軟模 46.3 塑膠微熱壓成型複製微結構圖案母模 48.4 氣體輔助軟模轉印設備 48.5 量測儀器簡介 50.5.1 光強計 50.5.2 表面接觸角量測儀 50.5.3 光學顯微鏡 50.5.4 微結構輪廓量測 50.5.5 3D雷射掃描顯微鏡 50.5.6 白光干涉儀 50.5.7 原子力顯微鏡 51.5.8 薄膜型力量感測器 51四章 軟式模具變形模擬分析.1 PDMS模具轉印時變形分析 66.2 有限元素法簡介 68.2.1 有限元素法 68.2.2 超彈性材料分析介紹 69.3 模型與模擬參數之建立 70.3.1 PDMS軟模與PMMA基材3D模型建立 70.3.2 PDMS軟模與PMMA基材之材料性質建立 70.3.3 邊界條件設定 72.3.4 元素選擇 72.3.5 網格分割 72.4 初步模擬結果與討論 73.5 模擬結果對照轉印參數分析與討論 73.5.1 施加壓力與微結構間隙差異分析 73.5.2 模具厚度與微結構間隙差異分析 74.6 模擬結果與實際變形之驗證 74.7 軟式模具變形模擬總結 75五章 氣體輔助軟模轉印技術之開發研究.1 氣體輔助軟模轉印製程設計開發 85.1.1 軟模轉印機制介紹 85.1.2 PDMS轉印模具 86.1.3 氧氣電漿表面處理 86.1.4 表面能控制—轉印溫度 88.1.5 加壓方法 89.1.6 轉印製程步驟 89.2 軟模轉印缺陷探討及解決方法 90.3 轉印製程參數探討 91.3.1 轉印製程參數探討-旋塗速率 92.3.2 轉印製程參數探討-轉印時間 92.3.3 轉印製程參數探討-轉印溫度 93.3.4 轉印製程參數探討-轉印壓力 94.4 製作多層堆疊結構 95.5 不同基材之轉印測試 95.6 氣體輔助軟模轉印製程總結 96六章 氣體輔助軟模轉印技術之應用.1 有機薄膜電晶體源極/汲極製作 120.2 銦錫氧化物薄膜蝕刻擋罩 121.3 無電鍍鎳擋罩 121.3 奈米結構轉印 122七章 結論與未來展望.1 研究成果總結 128.2 原始貢獻 129.3 未來研究方向與展望 130考文獻 134錄A：軟模受力變形模擬結果 14039299380 bytesapplication/pdfen-US轉印奈米壓印多層結構有機薄膜電晶體stampingprintingNILmuti-layerOTFTthesishttp://ntur.lib.ntu.edu.tw/bitstream/246246/187126/1/ntu-98-R96522712-1.pdf