Comparison of Cure Conditions for a Rigid Rod Epoxy and a Bisphenol A Epoxy Using Thermomechanical Analysis

Su, W-F. A.W-F. A.SuSchoch, K-FK-FSchochSmith, J-D B.J-D B.Smith2009-02-252018-06-282009-02-252018-06-281998http://ntur.lib.ntu.edu.tw//handle/246246/141025en-USComparison of Cure Conditions for a Rigid Rod Epoxy and a Bisphenol A Epoxy Using Thermomechanical Analysisjournal article