Liquid/solid and solid/solid reactions between SnAgCu lead-free solders and Ni surface finish

Luo W.-C.C. ROBERT KAO2019-11-272019-11-272002078037682X9780780376823https://www.scopus.com/inward/record.uri?eid=2-s2.0-84966667353&doi=10.1109%2fEMAP.2002.1188860&partnerID=40&md5=899c03274b9faad27195bb1b6fbc0dedhttps://scholars.lib.ntu.edu.tw/handle/123456789/432730Liquid/solid and solid/solid reactions between SnAgCu lead-free solders and Ni surface finishconference paper10.1109/EMAP.2002.11888602-s2.0-84966667353