Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu solders

Chen W.T.Ho C.E.C. ROBERT KAO2019-11-272019-11-27200208842914https://www.scopus.com/inward/record.uri?eid=2-s2.0-0036477472&doi=10.1557%2fJMR.2002.0036&partnerID=40&md5=453cf5a7387a41759604d39142de2dc0https://scholars.lib.ntu.edu.tw/handle/123456789/432735Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu soldersjournal article10.1557/JMR.2002.00362-s2.0-0036477472