Parameters Analysis of Chemical Mechanical Polishing: An Investigation based on the Pattern Planarization Model

DAR-ZEN CHENLee, Bor-ShinBor-ShinLee2021-11-042021-11-041999http://jes.ecsdl.org/content/146/2/744.full.pdfhttps://scholars.lib.ntu.edu.tw/handle/123456789/586248Parameters Analysis of Chemical Mechanical Polishing: An Investigation based on the Pattern Planarization Modeljournal article