2016-08-012024-05-13https://scholars.lib.ntu.edu.tw/handle/123456789/650589摘要：本整合型計畫將研發「毫米波CMOS 發射與接收端積體電路與系統封裝 (SiP) 技術研發」，並整合國內相關研究，期能建立國人自行研發38-GHz各項電路及關鍵元組件之能力以及系統構裝整合，以期應用於下世代行動通訊系統中。本整合型計畫含一項總計畫及三項子計畫，分由台大電資學院教授（六位）共同合作，其主要研究內容研發38-GHz毫米波載波聚合系統的關鍵元組件，開發直接升降頻收發之關鍵元組件系統晶片 (SoC) 與系統構裝 (SiP)，並使用載波聚合技術，佐以多輸入多輸出(MIMO)及相位陣列的系統架構，以完成高速行動通訊的應用，並展示其超高傳輸率的接收、發射之功能。<br> Abstract: The purpose of this multidisciplinary project “Millimeter-wave CMOS Transceiver Integrated Circuits and System-in-Package Technology Developmect” is to integrate the research efforts of 38-GHz wireless communication systems and key components for the application of next generation mobile communications. This group research project consists of one main project and three subprojects, which covers all the key component development and the related necessary techniques for analysis, design and system study. The members of this research team include six professors from the College of Electrical Engineering and Computer Science in National Taiwan University. We propose to develop the key components for 38-GHz direct up/down-conversion transceiver system-on-chip (SoC) and system-in-package (SiP) using carrier aggregation communication systems, together with multi-input multi-output (MIMO) and phased array architectures. Finally, we will demonstrate the millimeter-wave multi-gigabit transmit and receive functions to achieve the high speed data communication applications.毫米波CMOS收發機多輸入多輸出系統相位陣列載波聚合次世代行動通訊millimeter-waveCMOS transceivermulti-input multi-output (MIMO) systemphased arraycarrier aggregationnext generation mobile communications