Lee P.-THsieh W.-ZLee C.-YTseng S.-CTang M.-TChiang C.-YC. ROBERT KAOHo C.-E.2022-11-162022-11-16202213596462https://www.scopus.com/inward/record.uri?eid=2-s2.0-85126919378&doi=10.1016%2fj.scriptamat.2022.114682&partnerID=40&md5=444740af614f49db601f9ac3e0654d11https://scholars.lib.ntu.edu.tw/handle/123456789/625545Synchrotron X-ray analysis of the Sn electromigration behavior and Sn whisker growth in a Blech structure using nano-X-ray fluorescence microscopy and white beam Laue nanodiffraction was conducted. Sn depletion at the cathode and whisker/extrusion formation at the anode were characterized in-situ, and the results obeyed the electromigration kinetics. This electromigration scenario gradually decayed because of the counterbalance between electron wind force and back stress. White beam Laue nanodiffraction analysis showed that a noticeable compressive deviatoric stress in the direction of electron flow built up at the anode of Sn strips, particularly in the roots of Sn whiskers, confirming that electromigration-induced atomic accumulation occurred downstream in a strip and that Sn whiskering was closely related to internal stress resulting from atomic accumulation in confined segments. Finally, a theoretical model based on fundamental electromigration theory revealed that Sn diffused predominately through lattice and grain boundary paths at Sn homologous temperature of 0.6. © 2022 Acta Materialia Inc.Electromigration; Laue diffraction; Nano X-ray fluorescence; Sn whiskers; Synchrotron radiation[SDGs]SDG7Anodes; Electromigration; Fluorescence; Fluorescence microscopy; Grain boundaries; Lattice theory; Synchrotrons; X ray powder diffraction; Growth strain; Laue diffraction; Nano X-ray fluorescence; Nanodiffraction; Residual strain evolution; Sn whisker; Whisker growth; White beams; X ray fluorescence; X-ray studies; Synchrotron radiationjournal article10.1016/j.scriptamat.2022.1146822-s2.0-85126919378