吳文方Wu, Wen-Fang臺灣大學:機械工程學研究所孔維國Kong, Wei-KuoWei-KuoKong2010-06-302018-06-282010-06-302018-06-282008U0001-2707200815313800http://ntur.lib.ntu.edu.tw//handle/246246/187352本論文使用有限元素軟體進行球閘陣列構裝體(Ball Grid Array Package, BGA Package)模型之調和外力(Harmonic Excited)振動分析，並以量化可靠度探討參數變異對其錫球(Solder Ball)疲勞壽命之影響。而由於環保意識高漲，世界各國皆以電子產品無鉛化作為目標，為符合環保構裝(Green Package)的理念與趨勢，Sn-Ag-Cu合金為最廣泛使用來取代舊有含鉛(Pb)錫球的材料，故本文前半段為討論尺寸參數變異對含鉛及Sn-Ag-Cu無鉛錫球疲勞壽命之影響；後半段則僅以Sn-Ag-Cu無鉛錫球為對象，探討尺寸與材料參數變異對其疲勞壽命之影響，再針對其疲勞壽命預估模型做一分析。本研究前半段結果顯示，於相同振動環境下，無鉛錫球之疲勞壽命較舊有含鉛錫球要高，但尺寸參數造成疲勞壽命的離散性(Dispersion)卻較大；本論文後半段以有限元素分析與疲勞壽命預估模型交互驗證得知，無鉛錫球疲勞壽命於尺寸與材料參數交互作用(Interaction)下，所造成疲勞壽命的離散性大於上述兩者的單獨影響。It has been pointed out that vibration induced fatigue of solder balls is one of the major failure mechanisms of ball grid array (BGA) packages. Therefore, in the present paper, the life and reliability of a BGA package is studied in consideration of fatigue of its solder balls. Special attention is paid to the following issues. First, quantitative reliability in addition to qualitative reliability is studied. Secondly, to be compliant with the green packages requirement, fatigue life and reliability of solder balls made of Sn-Ag-Cu alloy (Pb-free) are compared with that made of Sn-Pb alloy. Thirdly, the influence of uncertainty/variation of solder ball geometry and/or material property on fatigue life and reliability estimation of the BGA is studied. The result shows that, under the same vibration condition, the BGA made of Pb-free solder balls has longer but more dispersive fatigue life than the one made of Pb solder balls. With regard to the uncertainty/variation of solder ball geometry and material property, it is found that interaction of both (geometry and material property) uncertainties results in more dispersive fatigue life than the case that only one uncertainty is considered.誌謝 I文摘要 IIbstract III錄 IV目錄 VI目錄 VII號說明 X一章 緒論 1.1 研究背景與動機 1.2 文獻回顧與研究目的 2.3 研究方法與論文架構 4二章 應用理論概述 8.1 振動學理論簡介 8.1.1 單自由度阻尼系統自由振動 8.1.2 單自由度阻尼系統調和外力振動 10.1.3 多自由度阻尼系統調和外力振動 12.2 錫球之疲勞壽命預估模型 13.2.1 疲勞曲線 13.2.2 錫球疲勞壽命預估模型 15.3 可靠度基本理論 16.3.1 連續機率分佈 16.3.2 機率點圖(Probability Plots) 19.3.3 卡方適合度檢定(Chi-Square Goodness-of-Fit Test) 21三章 有限元素模擬與尺寸參數變異分析 32.1 有限元素軟體 32.2 有限元素模型尺寸與材料參數設定 33.3 負載設定與邊界條件 34.4 尺寸參數變異 35.5 小結 36四章 無鉛錫球材料參數變異分析 57.1 前言 57.2 材料參數變異 58.3 尺寸與材料參數交互作用 58.4 小結 59五章 無鉛錫球疲勞壽命預估模型變異分析 71.1 前言 71.2 隨機變數A對疲勞壽命之影響 72.3 對疲勞壽命之影響 75.4 隨機變數A與 對疲勞壽命的影響 76.5 隨機變數B對疲勞壽命之影響 76.6 隨機變數A與B對疲勞壽命之影響 77.7 隨機變數A、B與 對疲勞壽命之影響 78.8 隨機變數A於不同 時對疲勞壽命之影響 78.9 小結 79六章 結論與未來展望 89.1 結論 89.2 未來展望 90考文獻 972640181 bytesapplication/pdfen-US調和外力振動分析離散性交互作用vibrationquantitative reliabilityinteractiondispersivethesishttp://ntur.lib.ntu.edu.tw/bitstream/246246/187352/1/ntu-97-R95522524-1.pdf