Efficient Thermal Analysis for Heat Dissipation in Three-Dimensional Chip-Stacking Packaging

Cheng-Yuan LuChien-Min LinRuey-Beei Wu2025-01-172025-01-172024-10-06https://scholars.lib.ntu.edu.tw/handle/123456789/724883[SDGs]SDG7Efficient Thermal Analysis for Heat Dissipation in Three-Dimensional Chip-Stacking Packagingconference paper10.1109/epeps61853.2024.10753706