SPICE-Compatible Thermal Simulation with Lumped Circuit Modeling for Thermal Reliability Analysis based on Model Reduction

Ting-Yuan WangCHUNG-PING CHEN2018-09-102018-09-102004-03http://scholars.lib.ntu.edu.tw/handle/123456789/310825[SDGs]SDG7SPICE-Compatible Thermal Simulation with Lumped Circuit Modeling for Thermal Reliability Analysis based on Model Reductionconference paper 10.1109/ISQED.2004.12837002-s2.0-2942648566