Chou H.-TWu K.-HLin Z.-HYan Z.-DLin D.-B.HSI-TSENG CHOU2022-04-252022-04-252021https://www.scopus.com/inward/record.uri?eid=2-s2.0-85123321167&doi=10.23919%2fISAP47258.2021.9614538&partnerID=40&md5=4c97da987a3bed8dd1671627db38a439https://scholars.lib.ntu.edu.tw/handle/123456789/607123In this paper, the design issues of antenna-in-package (AiP) is discussed to modularize arrays at millimeter-wave (mmW) frequencies for 5G applications. The current progress of AiP technologies at NTU is also summarized. The issues of considerations include different fabrication process, dielectric property deviation and mechanical limitations to realize the antenna structure. Antenna designs for various applications, ranging from user equipment, CPE to small cell BTS antennas, have been developed at different sizes. The radiation characteristics of these AiPs will be presented to demonstrate the behaviors of AiPs using these processes. Both full-wave simulations and experimental measurements will be presented to validate the AiP designs. ? 2021 Taiwan Microwave Association.Antenna arrayantennas-in-packagedesign considerationsdielectric substratesLTCCmillimeter-wave frequenciesSiP5G mobile communication systemsAntenna arraysDielectric propertiesDirectional patterns (antenna)Millimeter wavesModular constructionSilicon compounds'currentAntenna in packagesDesign considerationsDesign issuesDielectric substratesFrequency applicationsITS applicationsMillimeter wave frequenciesModularizationsSystem-in-packageconference paper10.23919/ISAP47258.2021.96145382-s2.0-85123321167