A comparative molecular dynamics study of copper trench fill properties between Ta and Ti barrier layers

Yang, J.Y.J.Y.YangHong, R.T.R.T.HongHuang, M.J.M.J.HuangMEI-JIAU HUANG2020-01-132020-01-132005https://scholars.lib.ntu.edu.tw/handle/123456789/447924A comparative molecular dynamics study of copper trench fill properties between Ta and Ti barrier layersjournal article10.1016/j.mssp.2006.02.0012-s2.0-33646873094https://www.scopus.com/inward/record.uri?eid=2-s2.0-33646873094&doi=10.1016%2fj.mssp.2006.02.001&partnerID=40&md5=3cad168c0dfed1cbe69323b90fe352a1