Effects of Cu content on the dissolution rate of Cu for real solder joint during reflow soldering

Chang C.-C.C. ROBERT KAO2019-11-272019-11-2720099781424443413https://www.scopus.com/inward/record.uri?eid=2-s2.0-77950828729&doi=10.1109%2fIMPACT.2009.5382305&partnerID=40&md5=ac377836b1247053b16eb0929d8d24e2https://scholars.lib.ntu.edu.tw/handle/123456789/432669Effects of Cu content on the dissolution rate of Cu for real solder joint during reflow solderingconference paper10.1109/IMPACT.2009.53823052-s2.0-77950828729