Effects of Ni addition to high-lead solders on the growth of Cu 3Sn and micro voids

Wang Y.W.C. ROBERT KAO2019-11-272019-11-2720099781424443413https://www.scopus.com/inward/record.uri?eid=2-s2.0-77950786772&doi=10.1109%2fIMPACT.2009.5382310&partnerID=40&md5=48c5d3a6636108a7963fb945c7ba8f3chttps://scholars.lib.ntu.edu.tw/handle/123456789/432670Effects of Ni addition to high-lead solders on the growth of Cu 3Sn and micro voidsconference paper10.1109/IMPACT.2009.53823102-s2.0-77950786772