Overflow-Aware Via Placement for Dense Die-to-Die Connections in Advanced Package Routing

Chang H.T.Liu W.-H.HUI-RU JIANGLin Z.-S.Tu Y.-H.Song B.-X.2025-10-272025-10-272025-01-01[9798331543129]https://scholars.lib.ntu.edu.tw/handle/123456789/732975falseOverflow-Aware Via Placement for Dense Die-to-Die Connections in Advanced Package Routingconference paper2-s2.0-105010822607