Analysis and experimental verification of the competing degradation mechanisms for solder joints under electron current stressing

Ke J.H.Yang T.L.Lai Y.S.C. ROBERT KAO2019-11-272019-11-27201113596454https://www.scopus.com/inward/record.uri?eid=2-s2.0-79951674215&doi=10.1016%2fj.actamat.2010.12.048&partnerID=40&md5=88d1d0e287b8a384f12835a69511b2d3https://scholars.lib.ntu.edu.tw/handle/123456789/432649Analysis and experimental verification of the competing degradation mechanisms for solder joints under electron current stressingjournal article10.1016/j.actamat.2010.12.0482-s2.0-79951674215