Intermetallic reactions in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with Au/Ni surface finishes

Chuang, T. H.T. H.ChuangYen, S. F.S. F.YenCheng, M. D.M. D.ChengChuangTH2009-01-062018-06-282009-01-062018-06-282006http://ntur.lib.ntu.edu.tw//handle/246246/95954application/pdf664354 bytesapplication/pdfen-USIntermetallic reactions in Sn3Ag0.5Cu and Sn3Ag0.5Cu0.06Ni0.01Ge solder BGA packages with Au/Ni surface finishesjournal articlehttp://ntur.lib.ntu.edu.tw/bitstream/246246/95954/1/96.pdf