Thermal SPICE Modeling of FinFET and BEOL Considering Frequency-Dependent Transient Response, 3-D Heat Flow, Boundary/Alloy Scattering, and Interfacial Thermal Resistance

Chung, C.-C.C.-C.ChungLin, H.H.H.H.LinWan, W.K.W.K.WanYang, M.-T.M.-T.YangCHEE-WEE LIU2021-02-222021-02-222019https://www.scopus.com/inward/record.url?eid=2-s2.0-85066014667&partnerID=40&md5=5bed2c1734d0f06bedea672af63a4086https://scholars.lib.ntu.edu.tw/handle/123456789/549165[SDGs]SDG7Thermal SPICE Modeling of FinFET and BEOL Considering Frequency-Dependent Transient Response, 3-D Heat Flow, Boundary/Alloy Scattering, and Interfacial Thermal Resistancejournal article10.1109/TED.2019.29124262-s2.0-85066014667