Inhibiting the formation of microvoids in Cu3Sn by additions of Cu to solders

Wang, Y.W.Y.W.WangLin, Y.W.Y.W.LinC. ROBERT KAO2012-10-242018-06-282012-10-242018-06-282010https://www.scopus.com/record/display.uri?eid=2-s2.0-77249094499&origin=resultslist&sort=plf-f&src=s&sid=496448ccfe2bcc4d95e3ba157a05e4a4&sot=b&sdt=b&s=TITLE-ABS-KEY%28Inhibiting+the+formation+of+microvoids+in+Cu3Sn+by+additions+of+Cu+to+solders%29&sl=92&sessionSearchId=496448ccfe2bcc4d95e3ba157a05e4a4&relpos=0en-USInhibiting the formation of microvoids in Cu3Sn by additions of Cu to soldersjournal article10.1016/j.jallcom.2009.12.0622-s2.0-77249094499http://ntur.lib.ntu.edu.tw/bitstream/246246/243913/-1/357.pdf