In-situ observation of material migration in flip-chip solder joints under current stressing

Tsai C.M.Lai Y.-S.Lin Y.L.Chang C.W.C. ROBERT KAO2019-11-272019-11-27200603615235https://www.scopus.com/inward/record.uri?eid=2-s2.0-33750181244&doi=10.1007%2fs11664-006-0157-2&partnerID=40&md5=357815571e6a54e43a89ac9d7051d3e3https://scholars.lib.ntu.edu.tw/handle/123456789/432709In-situ observation of material migration in flip-chip solder joints under current stressingjournal article10.1007/s11664-006-0157-22-s2.0-33750181244