Implementation of silicon-on-glass MEMS devices with embedded through-wafer silicon vias using the glass reflow process for wafer-level packaging and 3D chip integration

Lin, Chiung-WenChiung-WenLinHsu, Chia-PaoChia-PaoHsuYang, Hsueh-AnHsueh-AnYangWang, Wei ChungWei ChungWangWEICHUNG WANG2019-10-282019-10-2820080960-1317https://scholars.lib.ntu.edu.tw/handle/123456789/428600Implementation of silicon-on-glass MEMS devices with embedded through-wafer silicon vias using the glass reflow process for wafer-level packaging and 3D chip integrationjournal article10.1088/0960-1317/18/2/025018WOS:000252966100018