Graduate Inst. of Ind. Eng., National Taiwan Univ.Chen, ArgonArgonChenGuo, Ruey-ShanRuey-ShanGuoChou, Y.L.Y.L.ChouLin, C.L.C.L.LinDun, JoweiJoweiDunARGON CHEN2007-04-192018-06-292007-04-192018-06-291999-10http://ntur.lib.ntu.edu.tw//handle/246246/2007041908561608http://ntur.lib.ntu.edu.tw/bitstream/246246/2007041908561608/1/00808778.pdfhttps://www.scopus.com/inward/record.uri?eid=2-s2.0-0033354801&doi=10.1109%2fISSM.1999.808778&partnerID=40&md5=c41bb7d6cacb452f4eee81895b365775CMP processes are known to be erratic and unstable. A simple control strategy is to predict the run-To-run process removal rate and then adjust the processing time based on the prediction. EWMA and PCC techniques are two most often used prediction techniques. In this work, we revise the PCC design to take into account the ages of the abrasive pad and conditioning disc. It is shown that the proposed age-based technique can significantly improve the prediction capability and, thus, the control efficiency over conventional techniques. © 1999 IEEE.application/pdf238180 bytesapplication/pdfen-USChemical mechanical polishing; Forecasting; Manufacture; Semiconductor device manufacture; Aging of materials; Chemical polishing; Process control; Aging effects; Control efficiency; Control strategies; Conventional techniques; Prediction capability; Prediction techniques; Processing time; Run-to-run control; Process control; Semiconductor device manufacture; Chemical-mechanical polishing (CMP); Exponentially weighted moving average (EWMA)conference paper10.1109/issm.1999.80877810.1109/ISSM.1999.8087782-s2.0-0033354801http://ntur.lib.ntu.edu.tw/bitstream/246246/2007041908561608/1/00808778.pdf