Reaction of solder with Ni/Au metallization for electronic packages during reflow soldering

Ho C.E.Tsai S.Y.C. ROBERT KAO2019-11-272019-11-27200115213323https://www.scopus.com/inward/record.uri?eid=2-s2.0-0035521102&doi=10.1109%2f6040.982835&partnerID=40&md5=e1189f7c696736ac810676b5a3e759cehttps://scholars.lib.ntu.edu.tw/handle/123456789/432739Reaction of solder with Ni/Au metallization for electronic packages during reflow solderingjournal article10.1109/6040.9828352-s2.0-0035521102